15. RF MEMS and Si-Micromachining inHigh-Frequency Circuit Applications

RF MEMS (micro-electromechanical systems) and Si-micromachining have been identified as technology areas that have the potential to provide a major impact on existing system architectures in sensors and communications. These technologies should reduce weight, cost, size, and power dissipation by a few orders of magnitude. Key MEMS devices for current RF architectures are switches in radar systems, and filters in communication systems. Future communications needs require increasing system functionality to meet performance expectations of new, highly integrated sensors and instruments, commonly planned for the new generation of satellites. To maximize data transfer and minimize operation cost, future communication systems will be forced to move to higher frequencies. Communication-circuit miniaturization can be achieved by implementing a number of enabling technologies, based on RF MEMS and Simicromachining. These technologies include new circuit and component architectures, low-cost adaptive and re-configurable phased-array antennas, millimeter-wave devices, advanced materials and novel integration techniques, integrated systems on a chip, and new packaging methods for high-frequency electronics. RF micromachining and MEMS technologies promise to provide an innovative approach in the development of effective and low-cost circuits and systems, and are expected to have significant application in low-cost antenna arrays and re-configurable apertures. This paper discusses examples of MEMS switches and Si-micromachined circuits, appropriate for use in modern communications systems.